First Level Inc is a technology-based contract assembly facility located in Milwaukee, WI. Specializing in microelectronics packaging, the company operates Class 10,000 ESD protected cleanrooms for die attach, wire bonding, and component assembly, providing design, process, and manufacturing services.
With a team of expert engineers and highly skilled technicians, First Level Inc applies commercial packaging techniques to the microelectronics packaging industry, offering J-STD-001 and IPC-A-610 certified staff to ensure quality and precision in their services.
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