WayLink Systems Corporation is a leading U.S. technology company specializing in automated pavement data collection and analysis for highways, roadways, and airfields. With their flagship technology, CrackNet, they offer the first production-worthy AI-based solution for fully automated surveying of cracking and other distresses, utilizing their state-of-the-art Pave3D 8K laser imaging system.
WayLink Systems Corporation's expertise lies in the integration of cutting-edge sub-mm 3D laser imaging hardware, Deep-Learning based software, and the extensive knowledge of their senior staff, which is rooted in several renowned U.S. research universities. Serving clients worldwide, including the United States, Brazil, South Africa, China, and Japan, WayLink Systems Corporation is committed to making deep-learning technology accessible and revolutionizing the field of pavement surveying.
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