Mosaic Microsystems is a cutting-edge microelectronics and photonics packaging company based in Rochester, NY. With their proprietary VIAFFIRM bond technology, they specialize in providing thin glass solutions for the demanding packaging needs of next-generation microelectronics and photonics. Their expertise lies in handling wafer-thin glass substrates, offering custom through-glass vias, filled planar vias, and metallized thin glass for various applications.
With a focus on markets such as RF, package substrates, MEMS, sensing, and photonics, Mosaic Microsystems leverages the low electrical loss, low roughness, and scalability of thin glass substrates to deliver optimal solutions. Their experienced team, backed by extensive industry knowledge, ensures the successful execution of projects in the microelectronics field. Stay updated with their latest advancements in thin glass technology through their news and press releases.
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