Upwind Technology Inc, located in Sterling Heights, MI, is a leading provider of Smarter Faster CAE solutions, specializing in the Moldex3D TSV product. Under the leadership of Dr. Wen-Tzong Lee, the company offers a range of services and is dedicated to delivering high-quality results to its clients.
With their expertise in computer-aided engineering, Upwind Technology Inc is committed to providing innovative solutions that optimize performance and efficiency. Their advanced Moldex3D TSV technology sets them apart in the industry, making them a trusted partner for organizations seeking cutting-edge CAE solutions.
Generated from the website