EGIDE USA Inc. designs, manufactures and sells hermetic packages for the protection and interconnection of several types of electronic or photonic chips. Located in Cambridge, Md., the company's capabilities include Industrial equipment, quality and environment, research and development and management. It utilizes a number of technologies, including glass-to-metal/ceramic-to-metal, plating, ceramic (HTCC) and MIM (Metal Injection Molding). EGIDE USA Inc. offers a range of products for its vast client base that include aluminum hermetic and butterfly packages, modulators, multi-chip modules, power and radio frequency packages, relay header and many more.
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