American Semiconductor is the leading provider of thin chip packaging solutions, specializing in Semiconductor-on-Polymer (SoP) technology that enables the production of the thinnest integrated circuits possible. With a comprehensive range of services and expertise, they support new product development and volume manufacturing for thin electronic systems.
Their advanced packaging technology and services include chip scale packaging, chip-on-flex assembly, and various engineering and design services. American Semiconductor's SoP process revolutionizes protected Fan-In, allowing for the integration of semiconductor functionality in ultra-thin integrated circuits, resulting in improved reliability and cost-effectiveness for next-generation semiconductor technology.
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