Tohoku-Microtec Co Ltd is a leading company specializing in 3D-IC and MEMS processes, offering full foundry services and partial process services to global customers. With state-of-the-art equipment and a cost-effective approach, they provide efficient solutions for R&D, prototyping, and small volume production.
As the exclusive technical representative of GINTI Global Integration Initiative facility, Tohoku-Microtec Co Ltd is committed to delivering advanced technologies such as fine-pitch Micro-TSV, Micro-Bump, and Au Cylinder Bump. Their expertise extends to various projects, including pixel detectors, Si Interposers, and bilateral Si Microprobes, making them a trusted partner in the semiconductor industry.
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