POLYSTAK is a leading provider of 3D packaging solutions for the communication, computing, and network industries. Their innovative MCP and SiP solutions enable mobile phones and other handheld devices to be smaller yet more functional, addressing the challenge of limited space. With a proven track record and partnerships with major semiconductors and leading OEMs, POLYSTAK's products and services are trusted in various markets, including mobile phones, digital cameras, PCs, servers, routers, and more.
With a focus on digital convergence, POLYSTAK offers cutting-edge technology such as Direct Stacking and Multi-Chip Package (MCP), catering to the evolving needs of customers in the wireless and computer networking sectors. Their commitment to quality and customer satisfaction has established them as a reliable and preferred choice for 3D packaging solutions, enabling their clients to create smaller yet highly functional end products.
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