Micro Dicing Services is a leading provider of sawing services to the microelectronic and optical industries, specializing in processing hard to cut and brittle materials. With a full in-house production and research facility, their team of experienced engineers and a Ph.D. offer precision dicing, cutting, and sawing services, along with custom blade production, to meet the R&D and production needs of their clients.
They have expertise in handling a wide range of materials, including ICs, glass and ceramics, crystals, substrates, metals, and various shapes, providing quick turnaround services and consultation to ensure the highest quality results.
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