Established in 1996, FlipChip International is one of the leading privately held suppliers of wafer level packaging and flip chip bumping products and services. The company offers UltraCSP, which is a patented wafer level chip scale package. It provides processing services for all types of silicon and germanium wafers. FlipChip International is a wholly owned subsidiary of RoseStreet Labs, which is a provider of semiconductor and renewable energy products and services. The company offers a variety of services, including Standard Flip Chip, formerly known as Flex-on-Cap, Spheron and EliteCSP. Its capabilities include inspection, cross and planar sectioning, interface analysis and material characterization services. FlipChip International additionally specializes in laser marking, background coating and electronic wafer yield mapping services.
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