Die-Bond, a specialized company under Refrac Systems, utilizes the innovative LID bonding technology to enhance the plastics mold industry. Their liquid interface diffusion process allows for the seamless joining of split-layer injection molding dies, resulting in faster production and reduced fabrication costs.
With capabilities such as high vacuum hot pressing, heat treating, and diffusion bonding, Die-Bond engineers precision-made dies with complex conformal cooling passages. Their L.I.D. bonding method ensures higher bond strength and ductility, minimizing problems like braze alloy fillet plugging and waste of die-material.
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